Dusan Petranovic

Publication Activity (10 Years)

Years Active: 1998-2021
Publications (10 Years): 3

Top Topics

Automatic Extraction

Modeling Method

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng
Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design. ACM Great Lakes Symposium on VLSI (2021)
Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. ISPD (2020)
M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng
Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design. ICCAD (2020)
Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim
Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs. ICCAD (2015)
Yarui Peng, Dusan Petranovic, Sung Kyu Lim
Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34 (12) (2015)
Yarui Peng, Dusan Petranovic, Sung Kyu Lim
Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling. DAC (2014)
Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim
Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33 (12) (2014)
Nur Kurt-Karsilayan, Jim Falbo, Dusan Petranovic
Efficient and accurate RIE modeling methodology for BEOL 2.5D parasitic extraction. MWSCAS (2014)
Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim
On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. ICCAD (2013)
Ahmed Shebaita, Debasish Das, Dusan Petranovic, Yehea I. Ismail
A Novel Moment Based Framework for Accurate and Efficient Static Timing Analysis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30 (8) (2011)
Youngmin Kim, Dusan Petranovic, Dennis Sylvester
Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion. IEEE Trans. Very Large Scale Integr. Syst. 17 (8) (2009)
Matthew Hogan, Dusan Petranovic
Robust verification of 3D-ICs: Pros, cons and recommendations. 3DIC (2009)
Ahmed Shebaita, Dusan Petranovic, Yehea I. Ismail
Including inductance in static timing analysis. ICCAD (2007)
Youngmin Kim, Dusan Petranovic, Dennis Sylvester
Simple and Accurate Models for Capacitance Increment due to Metal Fill Insertion. ASP-DAC (2007)
Ahmed Shebaita, Dusan Petranovic, Yehea I. Ismail
Importance of volume discretization of single and coupled interconnects. ICCAD (2006)
Sunil Yu, Dusan Petranovic, Shoba Krishnan, Kwyro Lee, Cary Y. Yang
Resistance Matrix in Crosstalk Modeling for Muliconductor Systems. ISQED (2004)
Seapahn Meguerdichian, Farinaz Koushanfar, Advait Mogre, Dusan Petranovic, Miodrag Potkonjak
MetaCores: Design and Optimization Techniques. DAC (2001)
Veselin N. Ivanovic, Ljubisa A. Stankovic, Dusan Petranovic
Finite word-length effects in implementation of distributions for time-frequency signal analysis. IEEE Trans. Signal Process. 46 (7) (1998)