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Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options.

Jinwoo KimLingjun ZhuHakki Mert TorunMadhavan SwaminathanSung Kyu Lim
Published in: DAC (2021)
Keyphrases
  • empirical studies
  • databases
  • data mining
  • statistical analysis
  • integrated circuit
  • database
  • computer vision
  • decision making
  • expert systems
  • artificial neural networks
  • theoretical framework