Uwe Kerst

Publication Activity (10 Years)

Years Active: 2005-2015
Publications (10 Years): 1

Top Topics

Highly Efficient

Top Venues

Microelectron. Reliab.

Publications

Norman Dodel, Stefan Keil, Andreas Wiemhofer, Malte Kortstock, Philipp Scholz, Uwe Kerst, Roland Thewes
A BIST structure for the evaluation of the MOSFET gate dielectric interface state density in post-processed CMOS chips. ESSCIRC (2015)
Philipp Scholz, Norbert Herfurth, Michael Sadowski, Ted R. Lundquist, Uwe Kerst, Christian Boit
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm. Microelectron. Reliab. 54 (9-10) (2014)
Christian Boit, Clemens Helfmeier, Uwe Kerst
Security Risks Posed by Modern IC Debug and Diagnosis Tools. FDTC (2013)
Clemens Helfmeier, Christian Boit, Uwe Kerst
On charge sensors for FIB attack detection. HOST (2012)
Mahyar Boostandoost, Uwe Kerst, Christian Boit
Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC. Microelectron. Reliab. 50 (9-11) (2010)
Philipp Scholz, Christian Gallrapp, Uwe Kerst, Ted R. Lundquist, Christian Boit
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectron. Reliab. 50 (9-11) (2010)
Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectron. Reliab. 49 (9-11) (2009)
Ulrike Kindereit, Christian Boit, Uwe Kerst, Steven Kasapi, Radu Ispasoiu, Roy Ng, William K. Lo
Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology. Microelectron. Reliab. 48 (8-9) (2008)
Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Des. Test Comput. 25 (3) (2008)
Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectron. Reliab. 47 (9-11) (2007)
Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger
Backside E-Beam Probing on Nano scale devices. ITC (2007)
Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node. Microelectron. Reliab. 46 (9-11) (2006)
Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner
Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC (2005)
Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectron. Reliab. 45 (9-11) (2005)