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Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy.
Rudolf Schlangen
Uwe Kerst
Christian Boit
Tahir Malik
Rajesh Jain
Ted R. Lundquist
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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electron microscopy
nano scale
transmission electron microscopy
x ray
low energy
image stacks
thin film
high speed
neural network
cost effective
quality control
printed circuit boards
physical design
vlsi implementation