Mohd Zulkifly Abdullah

Publication Activity (10 Years)

Years Active: 2010-2021
Publications (10 Years): 12

Top Topics

Response Surface Methodology

High Temperature

Lattice Boltzmann

Top Venues

Microelectron. Reliab.

Simul. Model. Pract. Theory

Comput. Math. Methods Medicine

Publications

Seng Man Wong, Hann Woei Ho, Mohd Zulkifly Abdullah
Design and Fabrication of a Dual Rotor-Embedded Wing Vertical Take-Off and Landing Unmanned Aerial Vehicle. Unmanned Syst. 9 (1) (2021)
Nazmi Che Ismail, Mohd Zulkifly Abdullah, Khairil Faizi Mustafa, Nurul Musfirah Mazlan, Prem Gunnasegaran, Agustinus Purna Irawan
Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency. Entropy 23 (12) (2021)
Nazmi Che Ismail, Mohd Zulkifly Abdullah, Nurul Musfirah Mazlan, Khairil Faizi Mustafa
Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner. Entropy 22 (10) (2020)
Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81 (2018)
A. M. Najib, Mohd Zulkifly Abdullah, A. A. Saad, Z. Samsudin, F. Che Ani
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. Microelectron. Reliab. 79 (2017)
M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, A. A. Saad, Mohd Zulkifly Abdullah
nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79 (2017)
Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72 (2017)
Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz
Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. Microelectron. Reliab. 72 (2017)
Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor
Lattice Boltzmann method study of bga bump arrangements on void formation. Microelectron. Reliab. 56 (2016)
Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66 (2016)
Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. Comput. Math. Methods Medicine 2016 (2016)
Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. Microelectron. Reliab. 65 (2016)
M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. Simul. Model. Pract. Theory 57 (2015)
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. Microelectron. Reliab. 54 (8) (2014)
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz
Influence of solder bump arrangements on molded IC encapsulation. Microelectron. Reliab. 54 (4) (2014)
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. Microelectron. Reliab. 53 (12) (2013)
C. Y. Khor, Mohd Zulkifly Abdullah
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. Microelectron. Reliab. 53 (2) (2013)
C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan
Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectron. Reliab. 52 (1) (2012)
Motasem H. Ghanim, Kamariah Hasan, Nazalan Najimudin, Mohd Zulkifly Abdullah
Design of DNA biosensors and amperometric microchips featuring copper electrodes. BHI (2012)
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. Microelectron. Reliab. 52 (4) (2012)
Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. Microelectron. Reliab. 52 (6) (2012)
C. Y. Khor, Mohd Zulkifly Abdullah
Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology. Simul. Model. Pract. Theory 29 (2012)
Nur Afande Ali Hussain, Ting Ming Chung, Mohd Rizal Arshad, Rosmiwati Mohd-Mokhtar, Mohd Zulkifly Abdullah
Design of an underwater glider platform for shallow-water applications. Int. J. Intell. Def. Support Syst. 3 (3/4) (2010)
C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50 (1) (2010)