Login / Signup

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. KhorMohd Zulkifly AbdullahChun-Sean LauW. C. LeongM. S. Abdul Aziz
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • information integration
  • integrated circuit
  • neural network
  • computer vision
  • case study
  • evolutionary algorithm
  • object oriented databases
  • factors influencing
  • printed circuit boards
  • high temperature