C. Y. Khor

Publication Activity (10 Years)

Years Active: 2010-2024
Publications (10 Years): 4

Top Topics

Computational Fluid Dynamics

Temperature Field

Top Venues

Microelectron. Reliab.

Comput. Methods Programs Biomed.

Simul. Model. Pract. Theory

Publications

W. M. Faizal, C. Y. Khor, Suhaimi Shahrin, M. H. M. Hazwan, M. Ahmad, M. N. Misbah, A. H. M. Haidiezul
Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations. Comput. 12 (1) (2024)
W. M. Faizal, Nik Nazri Nik Ghazali, C. Y. Khor, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Norliza Binti Ibrahim, Roziana M. Razi
Computational fluid dynamics modelling of human upper airway: A review. Comput. Methods Programs Biomed. 196 (2020)
W. M. Faizal, Nik Nazri Nik Ghazali, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Mohamad Azlin Bin Ali, C. Y. Khor, Norliza Binti Ibrahim, Roziana M. Razi
A review of fluid-structure interaction simulation for patients with sleep related breathing disorders with obstructive sleep. Comput. Methods Programs Biomed. 180 (2019)
M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. Simul. Model. Pract. Theory 57 (2015)
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. Microelectron. Reliab. 54 (8) (2014)
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz
Influence of solder bump arrangements on molded IC encapsulation. Microelectron. Reliab. 54 (4) (2014)
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. Microelectron. Reliab. 53 (12) (2013)
C. Y. Khor, Mohd Zulkifly Abdullah
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. Microelectron. Reliab. 53 (2) (2013)
C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan
Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectron. Reliab. 52 (1) (2012)
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. Microelectron. Reliab. 52 (4) (2012)
C. Y. Khor, Mohd Zulkifly Abdullah
Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology. Simul. Model. Pract. Theory 29 (2012)
C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50 (1) (2010)