M. S. Abdul Aziz

Publication Activity (10 Years)

Years Active: 2014-2017
Publications (10 Years): 3

Top Topics

Printed Circuit Boards

Response Surface Methodology

Optimization Problems

Top Venues

Microelectron. Reliab.

Simul. Model. Pract. Theory

Publications

Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz
Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. Microelectron. Reliab. 72 (2017)
Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66 (2016)
M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. Simul. Model. Pract. Theory 57 (2015)
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz
Influence of solder bump arrangements on molded IC encapsulation. Microelectron. Reliab. 54 (4) (2014)