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Fei Chong Ng
Publication Activity (10 Years)
Years Active: 2016-2018
Publications (10 Years): 3
Top Topics
Activity Recognition
Regression Analysis
Simulation Study
Iterative Process
Top Venues
Microelectron. Reliab.
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Publications
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Fei Chong Ng
,
Aizat Abas
,
Mohd Zulkifly Abdullah
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab.
81 (2018)
Fei Chong Ng
,
Aizat Abas
,
Z. L. Gan
,
Mohd Zulkifly Abdullah
,
F. Che Ani
,
M. Yusuf Tura Ali
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab.
72 (2017)
Fei Chong Ng
,
Aizat Abas
,
Muhammad Hafifi Hafiz Ishak
,
Mohd Zulkifly Abdullah
,
M. S. Abdul Aziz
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab.
66 (2016)