Aizat Abas

Publication Activity (10 Years)

Years Active: 2016-2021
Publications (10 Years): 8

Top Topics

Correct Classification

High Temperature

Particle Image Velocimetry

Lattice Boltzmann

Top Venues

Microelectron. Reliab.

Microelectron. J.

Comput. Math. Methods Medicine

Publications

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin, Idris Mansor
No-flow underfill: Effect of chip placement speed on the void formation using numerical method. Microelectron. J. 114 (2021)
Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81 (2018)
M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, A. A. Saad, Mohd Zulkifly Abdullah
nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79 (2017)
Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72 (2017)
Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor
Lattice Boltzmann method study of bga bump arrangements on void formation. Microelectron. Reliab. 56 (2016)
Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66 (2016)
Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. Comput. Math. Methods Medicine 2016 (2016)
Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. Microelectron. Reliab. 65 (2016)