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Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process.
Muhammad Hafifi Hafiz Ishak
Mohd Zulkifly Abdullah
Aizat Abas
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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three dimensional
pairwise
multiresolution
high speed