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Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Fei Chong Ng
Aizat Abas
Mohd Zulkifly Abdullah
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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low cost
image processing
high speed
data mining
arbitrary shape
particle image velocimetry