F. Che Ani

Publication Activity (10 Years)

Years Active: 2010-2017
Publications (10 Years): 4

Top Topics

Correct Classification

Optimization Model

Top Venues

Microelectron. Reliab.

Publications

A. M. Najib, Mohd Zulkifly Abdullah, A. A. Saad, Z. Samsudin, F. Che Ani
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. Microelectron. Reliab. 79 (2017)
M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, A. A. Saad, Mohd Zulkifly Abdullah
nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79 (2017)
Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72 (2017)
Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor
Lattice Boltzmann method study of bga bump arrangements on void formation. Microelectron. Reliab. 56 (2016)
Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. Microelectron. Reliab. 52 (6) (2012)
C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50 (1) (2010)