D. Ramdan

Publication Activity (10 Years)

Years Active: 2012-2012
Publications (10 Years): 0

Top Topics

Integrated Circuit

Structural Properties

Top Venues

Microelectron. Reliab.

Publications

C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan
Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectron. Reliab. 52 (1) (2012)