Lei Su

Publication Activity (10 Years)

Years Active: 2013-2024
Publications (10 Years): 14

Top Topics

Som Neural Network

Sparse Reconstruction

Defect Detection

Experimental Verification

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Informatics

Publications

Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht
Flip-chip solder bumps defect detection using a self-search lightweight framework. Adv. Eng. Informatics 60 (2024)
Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht
Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection. IEEE Trans. Ind. Informatics 20 (8) (2024)
Lei Su, Xiaonan Yu, Ke Li, Jiefei Gu, Michael G. Pecht
Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation. IEEE Trans. Ind. Electron. 68 (10) (2021)
Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls. IEEE Trans. Ind. Informatics 16 (3) (2020)
Xingyan Yao, Saurabh Saxena, Lei Su, Michael G. Pecht
The Explosive Nature of Tab Burrs in Li-Ion Batteries. IEEE Access 7 (2019)
Lei Su, Xiaonan Yu, Ke Li, Xingyan Yao, Michael G. Pecht
Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound. IEEE Access 7 (2019)
Ke Li, Meng Xiong, Fucai Li, Lei Su, Jingjing Wu
A novel fault diagnosis algorithm for rotating machinery based on a sparsity and neighborhood preserving deep extreme learning machine. Neurocomputing 350 (2019)
Ke Li, Rui Zhang, Fucai Li, Lei Su, Huaqing Wang, Peng Chen
A New Rotation Machinery Fault Diagnosis Method Based on Deep Structure and Sparse Least Squares Support Vector Machine. IEEE Access 7 (2019)
Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14 (12) (2018)
Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su
Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectron. Reliab. 81 (2018)
Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings. Sensors 17 (3) (2017)
Ke Li, Jingjing Wu, Qiuju Zhang, Lei Su, Peng Chen
New Particle Filter Based on GA for Equipment Remaining Useful Life Prediction. Sensors 17 (4) (2017)
Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao
Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging. Sensors 16 (10) (2016)
Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. Microelectron. Reliab. 67 (2016)
Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi
Using RBF networks for detection and prediction of flip chip with missing bumps. Microelectron. Reliab. 55 (12) (2015)
Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration. Microelectron. Reliab. 55 (12) (2015)
Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao
Genetic algorithms for defect detection of flip chips. Microelectron. Reliab. 55 (1) (2015)
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. Sensors 13 (12) (2013)