Xiangning Lu

Publication Activity (10 Years)

Years Active: 2013-2023
Publications (10 Years): 8

Top Topics

Automated Visual Inspection

Disturbance Rejection

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Informatics

Publications

Zhanchao Wang, Min Huang, Lulu Qian, Yan Sun, Xiangning Lu, Wenhao Zhao, Zixuan Zhang, Guangming Wang, Yixin Zhao
Near-Space Wide-Area and High-Resolution Imaging System Design and Implementation. Sensors 23 (14) (2023)
Xiangning Lu, Lulu Qian, Zhanchao Wang, Wei Han, Min Huang, Zixuan Zhang
Mechanical Shutter Testing System Design and Signal Processing Based on LabVIEW. ICSPCC (2023)
Liangjie Zhi, Min Huang, Wei Han, Zhanchao Wang, Xiangning Lu, Yang Bai, Han Gao
Improved Active Disturbance Rejection Double Closed-Loop Control of a Rotary-Type VCM in a Moving Mirror Control System. Sensors 22 (10) (2022)
Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls. IEEE Trans. Ind. Informatics 16 (3) (2020)
Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14 (12) (2018)
Qisheng Cai, Huang Min, Wei Han, Yixuan Liu, Lulu Qian, Xiangning Lu
Principle and analysis of a rotational motion Fourier transform infrared spectrometer. Earth Observing Systems (2017)
Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. Microelectron. Reliab. 79 (2017)
Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. Microelectron. Reliab. 65 (2016)
Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao
Genetic algorithms for defect detection of flip chips. Microelectron. Reliab. 55 (1) (2015)
Wenyi Liu, Jiguang Han, Xiangning Lu
A new gear fault feature extraction method based on hybrid time-frequency analysis. Neural Comput. Appl. 25 (2) (2014)
Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao
Using active thermography for defects inspection of flip chip. Microelectron. Reliab. 54 (4) (2014)
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. Sensors 13 (12) (2013)