Using active thermography for defects inspection of flip chip.
Zhensong XuTielin ShiXiangning LuGuanglan LiaoPublished in: Microelectron. Reliab. (2014)
Keyphrases
- printed circuit boards
- defect detection
- automated visual inspection
- automatic inspection
- high speed
- visual inspection
- high density
- single chip
- quality control
- low cost
- databases
- physical design
- neural network
- integrated circuit
- machine vision
- information systems
- computer vision
- analog vlsi
- artificial intelligence
- surface defects