Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm.
Mengying FanLi WeiZhenzhi HeWei WeiXiangning LuPublished in: Microelectron. Reliab. (2016)
Keyphrases
- preprocessing
- dynamic programming
- matching algorithm
- classification algorithm
- detection algorithm
- computational cost
- np hard
- learning algorithm
- optimal solution
- objective function
- cost function
- worst case
- support vector machine svm
- image processing
- classification method
- multi class classification
- k means
- image analysis
- probabilistic model
- multi class
- expectation maximization
- machine learning