Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.

Lei Su Tielin Shi Zhensong Xu Xiangning Lu Guanglan Liao

Published in: Sensors (2013)

Keyphrases

printed circuit boards
surface defects
defect detection
visual inspection
automated visual inspection
integrated circuit
manufacturing process
analog vlsi
high speed
quality control
high density
image analysis
database
feature extraction
image processing
programmable logic
high temperature
neural network