Zirong Tang

Publication Activity (10 Years)

Years Active: 2009-2018
Publications (10 Years): 2

Top Topics

Defect Detection

Digital X Ray Images

Som Neural Network

White Blood Cells

Top Venues

Microelectron. Reliab.

Publications

Kepeng Chen, Tielin Shi, Qiang Liu, Zirong Tang, Guanglan Liao
Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods. Sensors 18 (11) (2018)
Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. Microelectron. Reliab. 67 (2016)
Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration. Microelectron. Reliab. 55 (12) (2015)
Yating Shi, Shiyuan Liu, Jinlong Zhu, Chuanwei Zhang, Xiuguo Chen, Zirong Tang
Optimal design of periodic nanostructures formed in solar cells as an antireflective layer. NEMS (2013)
Liangliang Xu, Tielin Shi, Shuang Xi, Hu Long, Shiyuan Liu, Zirong Tang
Metal-catalyst free integration of SiO2 nanowires into carbon MEMS. NEMS (2013)
Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao
Defect detection of flip-chip solder joints using modal analysis. Microelectron. Reliab. 52 (12) (2012)
Hao Lv, Shiyuan Liu, Peng Zhang, Zirong Tang
Fabrication of biomimetic gecko setae by direct photolithography and micromolding processes. NEMS (2011)
Zhigang Che, Liangcai Xiong, Tielin Shi, Zirong Tang, Huayang Cheng, Likun Yang
Numerical and experimental study of Microscale Laser Shock Processing using excimer laser. NEMS (2009)
Ping Peng, Tielin Shi, Guanglan Liao, Zirong Tang, Chang Liu
Scratch of submicron grooves on aluminum film with AFM diamond tip. NEMS (2009)
Jie Gong, Zirong Tang, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu
Improved adhesion between C-MEMS and substrate by micromechanical interlocking. NEMS (2009)
Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao
Low temperature direct bonding for hermetic wafer level packaging. NEMS (2009)