Defect detection of flip-chip solder joints using modal analysis.
Junchao LiuTielin ShiKe WangZirong TangGuanglan LiaoPublished in: Microelectron. Reliab. (2012)
Keyphrases
- defect detection
- high speed
- low cost
- high density
- feature extraction
- analog vlsi
- textured surfaces
- programmable logic
- automated visual inspection
- physical design
- circuit design
- input output
- network on chip
- vlsi implementation
- modular design
- vlsi design
- single chip
- evolvable hardware
- real time
- face recognition
- social networks
- machine learning
- neural network
- databases