Golta Khatibi

Publication Activity (10 Years)

Years Active: 2003-2018
Publications (10 Years): 11

Top Topics

Mechanical Properties

Reliability Assessment

High Temperature

Top Venues

Microelectron. Reliab.

Publications

Golta Khatibi, A. Betzwar Kotas, M. Lederer
Effect of aging on mechanical properties of high temperature Pb-rich solder joints. Microelectron. Reliab. 85 (2018)
Bernhard Czerny, Golta Khatibi
Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl. Microelectron. Reliab. (2018)
T. Walter, Golta Khatibi, Michael Nelhiebel, M. Stefenelli
Characterization of cyclic delamination behavior of thin film multilayers. Microelectron. Reliab. (2018)
Alice Lassnig, M. Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel
High cycle fatigue testing of thermosonic ball bonds. Microelectron. Reliab. 71 (2017)
A. Betzwar Kotas, Golta Khatibi
Isothermal bending fatigue response of solder joints in high power semiconductor test structures. Microelectron. Reliab. (2017)
Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen
Wire bond degradation under thermo- and pure mechanical loading. Microelectron. Reliab. (2017)
A. Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, M. Lederer, Johann Nicolics, L. Weiss
Reliability of Cu wire bonds in microelectronic packages. Microelectron. Reliab. 74 (2017)
Bernhard Czerny, A. Mazloum-Nejadari, Golta Khatibi, L. Weiss, M. Zehetbauer
Fatigue testing method for fine bond wires in an LQFP package. Microelectron. Reliab. 64 (2016)
T. Walter, M. Lederer, Golta Khatibi
Delamination of polyimide/Cu films under mixed mode loading. Microelectron. Reliab. 64 (2016)
Bernhard Czerny, Golta Khatibi
Interface reliability and lifetime prediction of heavy aluminum wire bonds. Microelectron. Reliab. 58 (2016)
E. Suhir, A. Bensoussan, Golta Khatibi, Johann Nicolics
Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges. IRPS (2015)
Peyman Rafiee, Golta Khatibi
A fast reliability assessment method for Si MEMS based microcantilever beams. Microelectron. Reliab. 54 (9-10) (2014)
Julien Magnien, Golta Khatibi
Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique. Microelectron. Reliab. 54 (9-10) (2014)
Bernhard Czerny, I. Paul, Golta Khatibi, M. Thoben
Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects. Microelectron. Reliab. 53 (9-11) (2013)
Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages. Microelectron. Reliab. 53 (9-11) (2013)
Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectron. Reliab. 52 (9-10) (2012)
Rainer Pelzer, Michael Nelhiebel, Robert Zink, Stefan Wöhlert, Alice Lassnig, Golta Khatibi
High temperature storage reliability investigation of the Al-Cu wire bond interface. Microelectron. Reliab. 52 (9-10) (2012)
Bernhard Czerny, Golta Khatibi, B. Weiss, T. Licht
A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects. Microelectron. Reliab. 50 (9-11) (2010)
Golta Khatibi, W. Wroczewski, B. Weiss, H. Ipser
A novel accelerated test technique for assessment of mechanical reliability of solder interconnects. Microelectron. Reliab. 49 (9-11) (2009)
Golta Khatibi, W. Wroczewski, B. Weiss, T. Licht
A fast mechanical test technique for life time estimation of micro-joints. Microelectron. Reliab. 48 (11-12) (2008)
Guy Lefranc, B. Weiss, Christof Klos, J. Dick, Golta Khatibi, H. Berg
Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectron. Reliab. 43 (9-11) (2003)