Vladimir N. Popok

Publication Activity (10 Years)

Years Active: 2013-2018
Publications (10 Years): 7

Top Topics

Preprocessing Phase

Reliability Assessment

Top Venues

Microelectron. Reliab.

Publications

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. Microelectron. Reliab. (2018)
Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok
Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. Microelectron. Reliab. (2017)
Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen
Wire bond degradation under thermo- and pure mechanical loading. Microelectron. Reliab. (2017)
Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok
Mechanisms of metallization degradation in high power diodes. Microelectron. Reliab. 64 (2016)
Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen
Comprehensive physical analysis of bond wire interfaces in power modules. Microelectron. Reliab. 58 (2016)
Kristian Bonderup Pedersen, Lotte Haxen Østergaard, Pramod Ghimire, Vladimir N. Popok, Kjeld Pedersen
Degradation mapping in high power IGBT modules using four-point probing. Microelectron. Reliab. 55 (8) (2015)
Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok
Effects of thermal cycling on aluminum metallization of power diodes. Microelectron. Reliab. 55 (9-10) (2015)
Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen
Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules. Microelectron. Reliab. 53 (9-11) (2013)