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Wire bond degradation under thermo- and pure mechanical loading.
Kristian Bonderup Pedersen
Dennis A. Nielsen
Bernhard Czerny
Golta Khatibi
Francesco Iannuzzo
Vladimir N. Popok
Kjeld Pedersen
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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bond pad
stress response
finite element model
wire bonding
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