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Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules.

Kristian Bonderup PedersenPeter Kjær KristensenVladimir N. PopokKjeld Pedersen
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • reliability assessment
  • high quality
  • higher quality
  • bp neural network model
  • neural network
  • power system
  • stress response
  • optimization problems
  • quality measures
  • image analysis
  • software defect