R. Eisele

Publication Activity (10 Years)

Years Active: 1995-2018
Publications (10 Years): 2

Top Topics

Mechanical Properties

Multiresolution

Multi Objective

Top Venues

Microelectron. Reliab.

Publications

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. Microelectron. Reliab. (2018)
Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok
Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. Microelectron. Reliab. (2017)
R. Eisele, C. Hausen, T. Schwan
Decision support for the economic evaluation of systems integration. ECIS (1995)