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Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.

Mads BrinckerS. SöhlR. EiseleVladimir N. Popok
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • mechanical properties
  • electron microscopy
  • databases
  • training phase
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  • multiscale
  • multiresolution
  • steady state
  • preprocessing phase