Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.
Mads BrinckerPeter Kjær KristensenS. SöhlR. EiseleVladimir N. PopokPublished in: Microelectron. Reliab. (2018)
Keyphrases
- machine learning
- electron microscopy
- multi objective
- mechanical properties
- multiobjective optimization
- differential evolution
- x ray
- evolutionary algorithm
- hybrid learning
- steady state
- databases
- thin film
- multiple objectives
- natural language processing
- decision trees
- search engine
- data mining
- real time
- co occurrence
- power system
- mathematical model
- multiscale
- case study
- genetic algorithm