High temperature storage reliability investigation of the Al-Cu wire bond interface.
Rainer PelzerMichael NelhiebelRobert ZinkStefan WöhlertAlice LassnigGolta KhatibiPublished in: Microelectron. Reliab. (2012)
Keyphrases
- high temperature
- user friendly
- data storage
- storage requirements
- bond pad
- wire bonding
- user interface
- direct manipulation
- interface design
- mechanical properties
- storage systems
- human computer interface
- data sets
- storage and retrieval
- electron microscopy
- storage management
- query processing
- metadata
- information systems
- friendly interface
- neural network
- databases