In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot.
Wuyu ZhangKun TanBing JiLei QiXiang CuiXiangyu ZhangLuchun DuPublished in: IEEE Trans. Ind. Electron. (2023)
Keyphrases
- fault diagnosis
- multiple faults
- fault detection
- model based diagnosis
- wire bonding
- fault detection and diagnosis
- fault model
- normal operation
- operating conditions
- fault identification
- fault detection and isolation
- output voltage
- high voltage
- simulation software
- stress response
- root cause
- fault models
- power system
- electric field
- dynamic systems
- pulse width modulation
- neural network
- single phase
- repair actions
- discrete event
- medical diagnosis
- test cases
- expert systems
- fault isolation
- dc dc converter
- transmission line
- power losses