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Luchun Du
Publication Activity (10 Years)
Years Active: 2023-2023
Publications (10 Years): 1
Top Topics
Fault Model
Wire Bonding
Fault Detection And Diagnosis
High Voltage
Top Venues
IEEE Trans. Ind. Electron.
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Publications
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Wuyu Zhang
,
Kun Tan
,
Bing Ji
,
Lei Qi
,
Xiang Cui
,
Xiangyu Zhang
,
Luchun Du
In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot.
IEEE Trans. Ind. Electron.
70 (3) (2023)