Seung-Boo Jung

Publication Activity (10 Years)

Years Active: 2006-2016
Publications (10 Years): 1

Top Topics

Specific Features

Electrical Properties

High Temperature

Top Venues

Microelectron. Reliab.

Publications

Dae Up Kim, Kwang-Seok Kim, Seung-Boo Jung
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications. Microelectron. Reliab. 63 (2016)
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. Microelectron. Reliab. 54 (2) (2014)
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. Microelectron. Reliab. 53 (12) (2013)
Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. Microelectron. Reliab. 48 (11-12) (2008)
Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung
Effect of surface finish material on printed circuit board for electrochemical migration. Microelectron. Reliab. 48 (4) (2008)
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. Microelectron. Reliab. 48 (11-12) (2008)
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48 (11-12) (2008)
Ja-Myeong Koo, Seung-Boo Jung
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging. Microelectron. Reliab. 47 (12) (2007)
Ja-Myeong Koo, Seung-Boo Jung
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package CoRR (2007)
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR (2007)
Jeong-Won Yoon, Seung-Boo Jung
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron. Reliab. 46 (5-6) (2006)
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectron. Reliab. 46 (2-4) (2006)