Hyun-Suk Chun

Publication Activity (10 Years)

Years Active: 2007-2008
Publications (10 Years): 0

Publications

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48 (11-12) (2008)
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR (2007)