Bo-In Noh

Publication Activity (10 Years)

Years Active: 2008-2014
Publications (10 Years): 0

Top Topics

Traffic Patterns

Market Conditions

Electrical Properties

High Temperature

Top Venues

Microelectron. Reliab.

Publications

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. Microelectron. Reliab. 54 (2) (2014)
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. Microelectron. Reliab. 53 (12) (2013)
Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung
Effect of surface finish material on printed circuit board for electrochemical migration. Microelectron. Reliab. 48 (4) (2008)
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. Microelectron. Reliab. 48 (11-12) (2008)
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48 (11-12) (2008)