Jeong-Won Yoon

Publication Activity (10 Years)

Years Active: 2006-2017
Publications (10 Years): 1

Top Topics

Traffic Patterns

Electrical Properties

High Temperature

Mathematical Expressions

Top Venues

Microelectron. Reliab.

Publications

Byung-suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. Microelectron. Reliab. 71 (2017)
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. Microelectron. Reliab. 54 (2) (2014)
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. Microelectron. Reliab. 53 (12) (2013)
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. Microelectron. Reliab. 48 (11-12) (2008)
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48 (11-12) (2008)
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR (2007)
Jeong-Won Yoon, Seung-Boo Jung
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron. Reliab. 46 (5-6) (2006)