Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
Jeong-Won YoonHyun-Suk ChunJa-Myeong KooSeung-Boo JungPublished in: CoRR (2007)
Keyphrases
- printed circuit boards
- high speed
- thin film
- high density
- analog vlsi
- low cost
- single chip
- programmable logic
- physical design
- failure rate
- host computer
- high temperature
- vlsi design
- mechanical properties
- evolvable hardware
- vlsi implementation
- high bandwidth
- circuit design
- level parallelism
- image sensor
- semiconductor devices
- solid models
- visual inspection