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Ja-Myeong Koo
Publication Activity (10 Years)
Years Active: 2007-2008
Publications (10 Years): 0
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Publications
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Jeong-Won Yoon
,
Hyun-Suk Chun
,
Bo-In Noh
,
Ja-Myeong Koo
,
Jong-Woong Kim
,
Hoo-Jeong Lee
,
Seung-Boo Jung
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.
Microelectron. Reliab.
48 (11-12) (2008)
Ja-Myeong Koo
,
Seung-Boo Jung
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.
Microelectron. Reliab.
47 (12) (2007)
Ja-Myeong Koo
,
Seung-Boo Jung
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
CoRR
(2007)
Jeong-Won Yoon
,
Hyun-Suk Chun
,
Ja-Myeong Koo
,
Seung-Boo Jung
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
CoRR
(2007)