Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.
Jeong-Won YoonHyun-Suk ChunBo-In NohJa-Myeong KooJong-Woong KimHoo-Jeong LeeSeung-Boo JungPublished in: Microelectron. Reliab. (2008)
Keyphrases
- experimental evaluation
- high precision
- objective function
- high speed
- detection method
- computational cost
- dynamic programming
- support vector machine svm
- preprocessing
- data sets
- cost function
- medical images
- clustering method
- support vector machine
- significant improvement
- segmentation method
- computational complexity
- feature extraction
- genetic algorithm
- synthetic data
- classification method
- feature selection
- wordnet
- edge detection
- high accuracy
- prior knowledge
- evolutionary algorithm
- similarity measure
- image segmentation