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Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.

Jeong-Won YoonBo-In NohYoung-Ho LeeHyo-Soo LeeSeung-Boo Jung
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • mechanical properties
  • electron microscopy
  • x ray
  • high temperature
  • optimal solution
  • constraint satisfaction problems