Login / Signup

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications.

Byung-suk LeeYong-Ho KoJung-Hwan BangChang-Woo LeeSehoon YooJun-Ki KimJeong-Won Yoon
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • electron microscopy
  • mechanical properties
  • x ray
  • decision making
  • power electronics
  • genetic algorithm
  • computational intelligence