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High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.

Jeong-Won YoonSeung-Boo Jung
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • high temperature
  • software aging
  • low energy
  • electron microscopy
  • highly reliable
  • age estimation
  • silicon dioxide
  • video sequences
  • diesel engine
  • genetic algorithm
  • x ray
  • reliability analysis
  • age related