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Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.

Jong-Woong KimJin-Kyu JangSang-Ok HaSang-Su HaDae-Gon KimSeung-Boo Jung
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • high speed
  • loading conditions
  • real time
  • operating conditions
  • neural network
  • sufficient conditions
  • numerical simulations