Paul S. Ho

Publication Activity (10 Years)

Years Active: 2002-2020
Publications (10 Years): 1

Top Topics

Integrated Circuit

Quantitative Analysis

Evolutionary Algorithm

Top Venues

Microelectron. Reliab.

Publications

Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho
Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. IRPS (2020)
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Rui Huang, Paul S. Ho
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias. Microelectron. Reliab. 53 (1) (2013)
Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints. Microelectron. Reliab. 49 (3) (2009)
Guotao Wang, Paul S. Ho, Steven Groothuis
Chip-packaging interaction: a critical concern for Cu/low k packaging. Microelectron. Reliab. 45 (7-8) (2005)
Krishnakumar Sundaresan, Paul S. Ho, Siavash Pourkamali, Farrokh Ayazi
A two-chip, 4-MHz, microelectromechanical reference oscillator. ISCAS (6) (2005)
Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai
Reliability issues for flip-chip packages. Microelectron. Reliab. 44 (5) (2004)
Ennis T. Ogawa, Ki-Don Lee, Volker A. Blaschke, Paul S. Ho
Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Trans. Reliab. 51 (4) (2002)
Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectron. Reliab. 42 (1) (2002)