Electromigration reliability issues in dual-damascene Cu interconnections.

Ennis T. Ogawa Ki-Don Lee Volker A. Blaschke Paul S. Ho

Published in: IEEE Trans. Reliab. (2002)

Keyphrases

integrated circuit
key issues
multiscale
special case
real time
neural network
face recognition
multi agent
user interface
high density
open issues
highly reliable