Wen-Jie Qi

Publication Activity (10 Years)

Years Active: 2002-2002
Publications (10 Years): 0

Publications

Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectron. Reliab. 42 (1) (2002)