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Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures.

Jie-Hua ZhaoWen-Jie QiPaul S. Ho
Published in: Microelectron. Reliab. (2002)
Keyphrases
  • multi layer
  • real time
  • high speed
  • vlsi circuits
  • thin film
  • application layer
  • anisotropic diffusion
  • diffusion model
  • electron beam