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Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips.

Weishen ChuLaura SpinellaDwayne R. ShirleyPaul S. Ho
Published in: IRPS (2020)
Keyphrases
  • high density
  • low density
  • chip design
  • high speed
  • integrated circuit
  • low cost
  • human computer interaction
  • evolutionary algorithm
  • network structure
  • software package
  • functional units