Masamoto Tago

Publication Activity (10 Years)

Years Active: 2003-2010
Publications (10 Years): 0

Publications

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Masayuki Mizuno, Tadahiro Kuroda
An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing. IEEE J. Solid State Circuits 45 (10) (2010)
Yoichiro Kurita, Koji Soejima, Katsumi Kikuchi, Masatake Takahashi, Masamoto Tago, Masahiro Koike, Koujirou Shibuya, Shintaro Yamamichi, Masaya Kawano
A 3-D Packaging Technology with Highly-Parallel Memory/Logic Interconnect. IEICE Trans. Electron. (12) (2009)
Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno
Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. ISSCC (2009)
Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Kiichi Niitsu, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, Takayasu Sakurai, Tadahiro Kuroda
A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link. IEEE J. Solid State Circuits 42 (1) (2007)
Kiichi Niitsu, Noriyuki Miura, Mari Inoue, Yoshihiro Nakagawa, Masamoto Tago, Masayuki Mizuno, Takayasu Sakurai, Tadahiro Kuroda
Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link. IEICE Trans. Electron. (4) (2007)
Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Kiichi Niitsu, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, Takayasu Sakurai, Tadahiro Kuroda
A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link. ISSCC (2006)
Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara
Ultra-high-density interconnection technology of three-dimensional packaging. Microelectron. Reliab. 43 (8) (2003)