A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link.
Noriyuki MiuraDaisuke MizoguchiMari InoueKiichi NiitsuYoshihiro NakagawaMasamoto TagoMuneo FukaishiTakayasu SakuraiTadahiro KurodaPublished in: IEEE J. Solid State Circuits (2007)
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