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An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing.

Yoichi YoshidaKoichi NoseYoshihiro NakagawaKoichiro NoguchiYasuhiro MoritaMasamoto TagoMasayuki MizunoTadahiro Kuroda
Published in: IEEE J. Solid State Circuits (2010)
Keyphrases
  • highly parallel
  • efficient implementation
  • parallel architectures
  • digital images
  • integrated circuit
  • single chip
  • real time
  • general purpose
  • digital camera
  • computing systems
  • single pass